3.0mm pitch DIP pin header gold-plated

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Product Description

Product Attributes

Packaging & Delivery

Product Description

Product Attributes

Model No.: 082806

Packaging & Delivery

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Product Description

DYGZCONN’s 3.0mm pitch DIP Pin Header with gold-plated pins is built for reliable and long-lasting connections in a variety of electronic devices. The gold plating improves conductivity and prevents corrosion, ensuring signals remain stable over time. It works perfectly with both 2 pin wire to board connector and 3 pin wire to board connector setups, making it easy to integrate into different circuit boards and systems.

This high-quality WAFER Header holds up well under repeated insertions and removals. Its solid structure keeps connections secure even in dusty or humid environments, much like a waterproof wire to board connector. The gold contacts provide low resistance, which helps maintain signal integrity and smooth operation in demanding applications.

Technicians and engineers choose this DIP pin header for its dependability and flexibility. It is widely used in communication equipment, industrial control systems, and consumer electronics where steady performance and durability matter most. With DYGZCONN’s commitment to quality, this 3.0mm pitch gold-plated DIP pin header delivers a stable and trustworthy connection every time.