1.27mm SMT patch with or without pillars

Discover dgyzconn's precision-engineered 1.27 Mm Pin Header solution for next-gen SMT applications. Our surface-mount patch headers feature a compact 1.27 Mm Pitch Header design with optional stabilizing pillars, delivering unmatched reliability in high-vibration environments. The Pin Header 1.27 Mm series supports automated pick-and-place assembly while its gold-plated contacts ensure <5mΩ resistance. Ideal for medical IoT and micro-robotics, this 1.27 Pin Header offers dual configurations: pillar-enhanced versions prevent solder cracking in thermal-cycling scenarios, while pillar-free variants enable ultra-low-profile installations. Engineered with 260°C reflow tolerance and halogen-free materials, our 1.27mm SMT solutions exceed IPC-610 Class 3 standards. Upgrade your miniaturized designs with dgyzconn's cutting-edge connectivity.

Item	Description
Application	Primarily used for internal device connections, not for external connectivity.
	Suitable for electronic products, industrial computers, communication systems, aftermarket components, etc.
Soldering Type	SMT / Straight / Right Angle / J Type / U Type
Number of Plastic Rows	Single row, Dual row
Rated Current	1A per pin
Operating Temperature	-40°C to +105°C
Terminal Material	C2680; C5191
Insulator Material	LCP (UL94V-0), Black
Processing Temperature Range	230°C to +260°C
Contact Resistance	Max 20mΩ
Contact Plating	Gold Flash plating
	Nickel underlayer: ≥50μ"
Number of Contacts	6–100 PINs
Certifications	IATF16949, ISO9001, ISO14000
RoHS Compliance	Yes
Materials	PA46, PA6T, PA9T, LCP
Packaging Details	Standard packaging in plastic trays + cartons, customizable upon request
Service Type	ODM and OEM services available, color customization supported